MT53D512M32D2DS-053 WT:D vs MT53E256M32D2DS-053 WT:B 对比
详细并排对比 MT53D512M32D2DS-053 WT:D 出自 Micron Technology 和 MT53E256M32D2DS-053 WT:B 出自 Micron Technology。对比关键规格、电气参数、封装、生命周期状态、价格和供货情况，以确定最适合您设计需求的元器件。
Micron Technology
MT53D512M32D2DS-053 WT:D - 16Gb LPDDR4 SDRAM | Micron
MT53D512M32D2DS-053 WT:D ✓ 量产中Micron Technology
MT53E256M32D2DS-053 - 8Gb LPDDR4 DRAM 1.866GHz | Micron
MT53E256M32D2DS-053 WT:B ✓ 量产中规格对比
| 参数 | MT53D512M32D2DS-053 WT:D | MT53E256M32D2DS-053 WT:B |
|---|---|---|
| 品牌 | Micron Technology | Micron Technology |
| 分类 | Memory ICs | Memory ICs |
| 生命周期状态 | 有效 | 有效 |
| 库存状态 | 有库存 | 有库存 |
| 单价（USD） | $6.05 | $21.90 |
| 存储器类型 | SDRAM - Mobile LPDDR4 | LPDDR4 SDRAM (Mobile DRAM) |
| 存储容量 | 16 Gbit (2 GB) | — |
| 存储组织 | 512M x 32 | 256M x 32 |
| Clock Frequency / Data Rate | 1.866 GHz (1866 MT/s) | — |
| 封装 | 200-WFBGA (10 mm x 14.5 mm) | 200-ball WFBGA, 10 x 14.5 mm |
| Die Configuration | DDP (Double Die Package) | — |
| 工作温度 | -40C to +85C | — |
| Speed Grade | -053 | — |
| 特性 | Auto self-refresh, built-in temperature sensor, auto precharge, write leveling, ZQ calibration, asynchronous reset, data mask | Auto precharge, write leveling, ZQ calibration |
| 安装类型 | Surface Mount | Surface Mount (BGA) |
| 数据总线宽度 | 32 bit | — |
| Memory Interface | Parallel, LPDDR4 | — |
| Self-Refresh | Auto self-refresh with temperature-compensated refresh | Auto self-refresh with built-in temperature sensor |
| Refresh | Auto refresh and self refresh | — |
| 电源电压 | [DATA_NEEDED: VDD/VDDQ supply voltage] | — |
| RoHS 状态 | RoHS Compliant (per DigiKey listing) | Compliant (per JLCPCB/LCSC listing) |
| Density | — | 8 Gbit (256M x 32) |
| 数据速率 | — | 1866 Mbps/pin (1.866 GHz) |
| Supply Voltage (VDD2/VDDQ) | — | 1.1 V |
| Operating Temperature (WT grade) | — | -30C to +85C |
| Bus Width | — | 32-bit |
| Peak Bandwidth (per device) | — | approximately 7.46 GB/s (32-bit x 1866 Mbps) |
| MSL 等级 | — | [DATA_NEEDED: MSL level] |
| Access Time / CAS Latency | — | [DATA_NEEDED: CL at 1866 Mbps] |
| Refresh Interval | — | [DATA_NEEDED: tREFI specification] |
| Package Height | — | [DATA_NEEDED: max package height] |